Power: 800W; Self-contained Micro-Processor control
The Infrared IC Heater Reflow Oven has a 180 x 235 mm soldering area.
Temperature Range: 100? - 350?; Cycle Time: 1?8 min
This reflow oven can solder single and double PCB panels with all kinds of encapsulation form.
Fast infrared radiation and circulating wind for heating make the temperature accurate and even.